As electronic devices continue to become smaller, faster and more powerful, advanced ceramic technologies such as MLCC (Multilayer Ceramic Capacitors), HTCC (High Temperature Co-fired Ceramics) and LTCC (Low Temperature Co-fired Ceramics) play a critical role in modern electronics.
While ceramic powders, conductive pastes and sintering technologies receive significant attention, production consumables such as release films, lamination films, dicing tapes and carrier tapes are equally important in ensuring manufacturing yield, dimensional accuracy and process stability.
This guide explains the key consumable materials used throughout MLCC, HTCC and LTCC manufacturing processes.
1. Tape Casting Process
Purpose
Tape casting converts ceramic slurry into thin and uniform green sheets that serve as the foundation of multilayer ceramic components.
Consumables Used
MLCC Release Film
Release film provides a temporary carrier surface for ceramic slurry coating and drying.
Key requirements:
- Ultra-smooth surface finish
- Stable release force
- Excellent solvent resistance
- High dimensional stability
- Uniform thickness tolerance
Applications:
- MLCC green sheet production
- HTCC tape casting
- LTCC tape casting
2. Green Sheet Cutting Process
Purpose
After drying, ceramic green sheets are cut into specified dimensions for subsequent processing.
Consumables Used
Micro-Adhesive Protection Film
This low-tack film protects fragile ceramic sheets from scratches, contamination and handling damage during cutting operations.
Benefits:
- Surface protection
- Easy removal
- No adhesive residue
- Clean-room compatible
3. Via Hole Punching Process
Purpose
HTCC and LTCC substrates require via holes for vertical electrical interconnection.
Consumables Used
Frame Mounting Tape
Used to secure ceramic sheets during mechanical punching or laser drilling.
Benefits:
- Precise positioning
- Reduced sheet movement
- Improved hole accuracy
Micro-Adhesive Film
Applied after punching to protect the ceramic surface from contamination.
4. Screen Printing Process
Purpose
Conductive circuits and electrode patterns are printed onto ceramic green sheets.
Consumables Used
Printer Roll Paper
Functions:
- Absorbs excess solvent
- Prevents vacuum table blockage
- Maintains printing consistency
PET Base Film
Provides support for thick ceramic substrates during printing operations.
Micro-Adhesive Film
Temporarily secures ceramic sheets during precision printing.
5. Lamination Process
Purpose
Multiple ceramic layers are stacked and bonded together under heat and pressure.
Consumables Used
Lamination Release Film
Lamination release films distribute pressure evenly and prevent sticking during hot pressing.
Key Features:
- Heat resistance up to 200°C
- Stable release properties
- Uniform thickness
- Excellent pressure transfer
Applications:
- MLCC multilayer stacking
- LTCC multilayer substrates
- HTCC ceramic packages
6. Isostatic Pressing Process
Purpose
Isostatic pressing removes voids and improves bonding between ceramic layers.
Consumables Used
Silicone Isostatic Pressing Pad
Benefits:
- Uniform pressure transmission
- Excellent resilience
- Long service life
- Improved product consistency
7. Precision Dicing Process
Purpose
Laminated ceramic blocks are separated into individual components or substrates.
This process requires reliable temporary fixation to prevent movement during cutting.
Consumables Used
Thermal Release Tape
Widely used in MLCC dicing applications.
Advantages:
- Strong holding force during cutting
- Clean release after heating
- No residue
- Reduced chip damage
UV Dicing Tape
Suitable for ceramic substrate and semiconductor packaging applications.
Advantages:
- High adhesion during dicing
- Easy component pickup after UV exposure
- Excellent dimensional stability
Applications:
- MLCC chips
- LTCC substrates
- Ceramic packages
- Electronic components
8. Electrical Testing Process
Purpose
Finished products undergo electrical and visual inspection.
Consumables Used
Anti-Static Film
Benefits:
- Electrostatic protection
- Temporary product fixation
- Reduced handling damage
9. Tape-and-Reel Packaging Process
Purpose
Qualified products are packaged for automated SMT assembly.
Consumables Used
Carrier Tape
Used to hold electronic components during transportation and automated placement.
Features:
- Anti-static materials
- Precision cavity design
- Excellent dimensional consistency
Cover Tape
Seals components inside carrier tapes during shipping and storage.
Features:
- Stable peel strength
- Reliable sealing
- High-speed SMT compatibility
Recommended Consumables for Ceramic Electronics Manufacturing
For MLCC, HTCC and LTCC manufacturers, the following products are commonly used throughout production:
- Release Film
- Lamination Release Film
- Micro-Adhesive Film
- Frame Mounting Tape
- Thermal Release Tape
- UV Dicing Tape
- Anti-Static Film
- Carrier Tape
- Cover Tape
- Silicone Isostatic Pressing Pads
Selecting the right consumables can significantly improve production yield, reduce contamination risks and enhance overall manufacturing efficiency.
Looking for Reliable Ceramic Manufacturing Consumables?
KAWIN provides a complete range of consumable materials for advanced ceramic electronics manufacturing, including MLCC, HTCC and LTCC production lines.
Our products are designed to support high-precision ceramic processing with stable quality, clean release performance and excellent process compatibility.
Contact our team today to discuss your application requirements.