Bergquist Thermally-Conductive Adhesive Tape

Product Highlights

This tape uses an acrylic bonding formulation reinforced with a thin dielectric film. The adhesive surface forms intimate contact with metal, ceramic or PCB substrates, helping remove heat from active components while keeping electrical insulation between layers. It is commonly used to attach heat sinks or housings to devices that generate significant heat during operation.

Key Features

• Double-sided pressure-sensitive adhesive

• Thermal conduction and electrical insulation in a single material

• No curing or mechanical fastening required

• Stable adhesion on metals, PCBs and coated surfaces

• Allows thin assembly design for compact electronics

• Suitable for continuous operating temperatures from approximately -30°C to 120°C (depending on grade)

• UL 94 V-0 flame retardant rating on many variants

Typical Technical Values (reference only)

• Construction: double-sided acrylic PSA with dielectric carrier (PEN or polyimide film)

• Thickness: around 0.14 mm (varies with product grade)

• Thermal conductivity: around 0.4 W/m·K

• Thermal impedance at 50 psi: approx. 0.87 °C-in²/W
  Performance varies depending on applied pressure, substrate type and surface flatness and should be validated in each application.

Recommended Applications

• Bonding heat sinks to PCB modules or power devices

• LED lighting modules and aluminum housings

• Automotive control units requiring insulation plus heat dissipation

• Power electronics where mechanical fasteners are difficult or space-limited

• Replacement for silicone grease or liquid adhesive in many low-profile heat paths

Why Engineers Choose Bergquist Tape

Bergquist tape is widely used in demanding OEM environments because it combines thermal interface performance, stable adhesion and dielectric insulation without converting processes. For large-scale production, the tape simplifies assembly and improves repeatability compared with liquid or mechanical options.

Available Formats

Continuous roll, sheet, kiss-cut, die-cut pads and custom-shaped parts for OEM assembly. Dimensions can be customized based on heat sink size or component layout.

Ordering Information

To recommend the correct grade, please confirm:

• component material and substrate

• required operating temperature

• electrical insulation requirement

• target thermal impedance

• thickness preference

• standard or custom die-cut shape