Key Features:
Excellent conductivity with low surface resistance
Effective EMI/RFI shielding for stable device performance
Flexible foam base for irregular surfaces
Strong adhesion with long-lasting bonding
Easy die-cutting and customization for various applications
Typical Applications:
Smartphones, tablets, laptops, and other consumer electronics
Communication devices, servers, and cabinets
Grounding and shielding for metal housings
EMI sealing and gap filling
Specifications (Customizable):
Thickness: 0.5mm – 5mm(Customizable)
Width: 3mm – 1000mm(Customizable)
Base Material: Conductive Fabric + PU Foam
Adhesive: Conductive Pressure-Sensitive Adhesive




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