Heat Release Protective Film | High-Temperature Debonding Film Manufacturer

Heat release protective film is a PET-based film coated with specially formulated thermal-sensitive adhesive. It offers stable adhesion at room temperature for secure fixation of components and dramatically reduces adhesion after heating, allowing quick and residue-free removal. Widely used in semiconductor wafer processing, FPCB manufacturing, LCD/OLED panels, and precision component assembly, this film ensures efficient and safe handling in advanced manufacturing environments.

Specifications

  • Material: PET base + thermal-sensitive adhesive layer

  • Thickness: 30μm – 100μm (customizable)

  • Width: 50mm – 1200mm (customizable)

  • Length: 50m – 2000m (customizable)

  • Adhesion: High tack at room temperature, ultra-low tack after heating

  • Color: Transparent, Light Blue, Custom options

  • Release Temperature: 80°C – 120°C (adjustable)

Features

  • Strong initial adhesion for stable processing

  • Rapid adhesion reduction when heated for efficient release

  • High transparency for optical inspection and automation

  • Anti-static treatment to minimize contamination risks

  • Excellent heat and chemical resistance for precision processes

  • Easy peel-off with no adhesive residue

Applications

  • Semiconductor wafer dicing and chip processing

  • FPCB (Flexible Printed Circuit Board) handling and assembly

  • LCD/OLED glass panel and touchscreen protection

  • Optical lens and precision electronic component processing

  • High-end electronics assembly and safe transportation

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