Thermal Conductive Silicone Pad | Dual Assurance of Heat Conduction & Electrical Insulation

In real-world electronic device assembly, components and heat sinks are rarely perfectly flat. Tiny gaps and roughness create thermal resistance, severely hindering heat transfer. Our Thermal Conductive Silicone Pad is an innovative material designed to solve this very challenge. It is soft and elastic, able to perfectly fill these minute gaps, ensuring a seamless interface between the heat source and the heat sink, and minimizing thermal resistance. What’s more, it also provides excellent electrical insulation, offering dual assurance of both heat dissipation and safety for your devices.

Core Advantages & Key Features

• Outstanding Pliability and Gap-Filling Capability The softness and compressibility of the silicone pad allow it to easily conform to various uneven, rough, or stepped surfaces, effectively displacing air at the interface, eliminating thermal resistance. This is more effective at transferring heat than any tape or rigid material.
• Reliable Electrical Insulation As an excellent insulator, the thermal conductive silicone pad can electrically isolate the heat-generating component from the heat sink or metal enclosure, preventing short circuits. This is crucial for high-voltage, high-current applications like power modules, IGBTs, and transformers.
• Efficient Heat Transfer and Long-Term Stability Formulated with high-quality thermal materials, our silicone pad has a high thermal conductivity, ensuring heat is quickly transferred from the source. Its stable chemical properties guarantee that thermal performance will not degrade during long-term use in high-temperature or complex environments.
• Diverse Selection and Flexible Application We offer silicone pads in various thicknesses, hardnesses, and thermal conductivities to meet your different design needs. Whether you need to fill a large gap, withstand high voltage, or pursue ultimate heat dissipation, there is a product that will perfectly match your application.

Technical Specifications

Typical Applications

• Power Modules & Inverters: For use between IGBTs, MOSFETs, and heat sinks to provide both heat dissipation and electrical insulation.
• High-Voltage Electronics: For thermal conduction and safe isolation between transformers, capacitors, and chassis.
• LED Drivers & High-Power LEDs: For filling irregular gaps between driver ICs and enclosures.
• Communication Equipment: For creating a reliable heat transfer path between CPUs, chipsets, and heat sinks.

Client Testimonials & Case Studies

“In our inverter design, both safety and thermal efficiency are non-negotiable. This thermal conductive silicone pad not only easily fills the minute gaps between the components and the enclosure but also provides the highest level of insulation we need, greatly enhancing product reliability. Our design team is very confident in it.” — Thermal Design Engineer, New Energy Technology Company

Frequently Asked Questions (FAQ)

• Q: How do I choose the right thickness? A: You need to measure the gap between the heat-generating component and the heat sink. Choose a pad slightly thicker than this gap to ensure it fully fills the space and maintains good contact after compression.
• Q: Do the pads require extra adhesive? A: Our products generally do not require extra adhesive. However, if your application requires a stronger bond, we can offer customized versions with single or double-sided pressure-sensitive adhesive.
• Q: Is it reusable? A: Some models of thermal conductive silicone pads can be reused after removal, but we recommend using a new pad in critical applications to ensure optimal thermal and insulation performance.