CUSTOM INDUSTRIAL TAPE SOLUTION

Custom Thermal Management Tape Manufacturing

Build the solution around thermal path, bond line, electrical isolation, compression and assembly pressure, rather than specifying only a tape name or nominal thickness.

Quick answer: KAWIN customizes thermally conductive tapes, graphite-related laminations, silicone pads and foil-based heat-spreading parts. Material selection and converted presentation are aligned to the real component and production process.

Thermally conductive pad installed between a power module and aluminum heat sink

CUSTOMIZABLE PRODUCT FORMS

What we can manufacture in this tape family

These options share one topic, but solve different engineering tasks. Select the closest form, then confirm the construction against your application.

Thermally Conductive Tape

Thin bonding between components and heat spreaders where attachment and heat transfer share one layer.

Silicone Thermal Pad

Compressible gap filling between uneven components and heat sinks.

Graphite Lamination

In-plane heat spreading with protective films, adhesive layers and die-cut geometry.

Copper / Aluminum Heat Spreader

Foil-based parts combining heat spreading, shielding or grounding functions.

Thermal Insulation Layer

Barriers and spacers used where heat flow must be controlled rather than increased.

Die-Cut Thermal Stack

Multi-layer thermal, dielectric and adhesive components supplied ready for assembly.

CONFIGURABLE PARAMETERS

Define the construction before defining the price

The quotation becomes meaningful only when the critical construction and delivery variables are known.

Primary decisionthermal path, bond line, electrical isolation, compression and assembly pressure
Materialsthermally conductive tapes, graphite-related laminations, silicone pads and foil-based heat-spreading parts
AdhesiveAcrylic, modified acrylic, silicone, rubber, conductive or specialty system as applicable
DimensionsThickness, width, length, pitch, shape and tolerances by drawing
PresentationRoll, sheet, spool, kit, kiss-cut roll or individual component
Quality recordApproved construction, drawing, packaging and inspection criteria

APPLICATION-LED SELECTION

Common decision situations

Use these scenarios to identify which details should be tested first.

LED and lighting

Thin bond line and long-term adhesion must be balanced against heat transfer.

Battery modules

Electrical isolation, flame behavior, compression and service temperature all affect the stack.

Power electronics

Gap tolerance and mounting pressure influence tape versus pad selection.

Display heat spreading

Graphite orientation, edge protection and die-cut geometry become central.

Selection boundaries

  • Thermal conductivity alone does not predict assembly temperature.
  • Bond-line thickness and contact resistance can dominate performance.
  • Confirm whether electrical isolation is required before selecting foil or graphite.

RELATED CUSTOM SOLUTIONS

Only the closest engineering neighbors

These links prevent an isolated page without turning the page into a directory of unrelated tapes.

CUSTOM THERMAL MANAGEMENT TAPE AND PADS FAQ

Frequently asked questions

The best thermal interface is selected around the assembly stack, not conductivity data alone.

Should the application use thermal tape or a thermal pad?+

Thermal tape combines heat transfer with attachment for relatively controlled interfaces. A compliant thermal pad is generally considered when larger gaps, tolerance variation or compression are present. Mechanical retention and service conditions should be reviewed with either option.

Is higher thermal conductivity always better?+

No. Actual thermal resistance also depends on thickness, contact area, surface flatness, wet-out or compression, interface pressure and long-term stability. A thinner, well-contacted material can outperform a higher-conductivity material that does not fit the joint.

Can the thermal interface also provide electrical insulation?+

Selected constructions can combine thermal transfer with electrical isolation, but dielectric requirements, puncture risk, edges, mounting pressure and aging must be specified. Electrical insulation should be validated in the finished assembly.

What information is needed for a die-cut thermal part?+

Provide the component and heat-sink drawing, gap range, thickness, target thermal performance, voltage requirement, compression or mounting force, operating temperature, liner needs and placement method. Openings and keep-out areas should be clearly dimensioned.

Have a drawing, sample or performance target?

Send the substrate, dimensions, service conditions and estimated quantity. We will identify the missing variables before proposing a construction.

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